Njengoko imveliso iye kwinguqu ephezulu, uphuhliso olukhawulezayo kwicandelo lamandla acocekileyo kunye nophuhliso lweshishini le-semiconductor kunye ne-photovoltaic, kunye nokusebenza kakuhle kunye nokukwazi ukucubungula ngokuchanekileyo izixhobo zedayimani ezikhulayo, kodwa umgubo wedayimani wokwenziwa njengezona zinto zibalulekileyo, isithili sedayimani kunye namandla okubamba i-matrix akunzima, ubomi besixhobo se-carbide sasekuqaleni abudluli ixesha elide. Ukuze kusonjululwe ezi ngxaki, eli shishini ngokubanzi lisebenzisa uphahla lomphezulu wedayimani olunezixhobo zesinyithi, ukuphucula iimpawu zalo zomphezulu, ukuphucula ukuqina, ukuze kuphuculwe umgangatho uwonke wesixhobo.
Indlela yokugquma umphezulu wedayimani ingaphezulu, kuquka ukugquma ngamakhemikhali, ukugquma nge-electroplating, ukugquma nge-magnetron, ukugquma nge-vacuum evaporation, ukusabela okushushu, njl.njl., kuquka ukugquma ngamakhemikhali kunye nokugquma ngenkqubo evuthiweyo, ukugquma okufanayo, kunokulawula ngokuchanekileyo ukwakheka kogquma kunye nobukhulu, iingenelo zokugquma ngokwezifiso, kube yiteknoloji esetyenziswa kakhulu kushishino.
1. i-chemical plating
I-Diamond powder chemical coating kukufaka i-diamond powder ecociweyo kwisisombululo se-chemical coating, kwaye ifake ii-metal ion kwisisombululo se-coating ngesenzo se-reducing agent kwisisombululo se-chemical coating, senza i-dense metal coating. Okwangoku, i-diamond chemical plating esetyenziswa kakhulu yi-chemical nickel plating-phosphorus (Ni-P) binary alloy idla ngokubizwa ngokuba yi-chemical nickel plating.
01 Ukwakheka kwesisombululo se-nickel plating solution yeekhemikhali
Ukwakheka kwesisombululo se-chemical plating kunempembelelo enkulu kwinkqubela phambili egudileyo, uzinzo kunye nomgangatho we-coating we-chemical reaction yayo. Ihlala iqulethe ityuwa ephambili, i-reducing agent, i-complexer, i-buffer, i-stabilizer, i-accelerator, i-surfactant kunye nezinye izinto. Umlinganiselo wecandelo ngalinye kufuneka ulungiswe ngononophelo ukuze kufezekiswe isiphumo esihle se-coating.
1, ityuwa ephambili: ngokuqhelekileyo yi-nickel sulfate, i-nickel chloride, i-nickel amino sulfonic acid, i-nickel carbonate, njl., indima yayo ephambili kukubonelela ngomthombo we-nickel.
2. I-arhente yokunciphisa: ikakhulu inika i-atomic hydrogen, inciphisa i-Ni2 + kwisisombululo sokufaka i-Ni kwaye iyibeke phezu kwamasuntswana edayimani, eyona nto ibalulekileyo kwisisombululo sokufaka i-Ni. Kushishino, i-sodium secondary phosphate enekhono lokunciphisa elinamandla, ixabiso eliphantsi kunye nozinzo oluhle lokufaka i-Ni isetyenziswa kakhulu njenge-arhente yokunciphisa. Inkqubo yokunciphisa inokufezekisa i-chemical plating kubushushu obuphantsi kunye nobushushu obuphezulu.
3, iarhente eyinkimbinkimbi: isisombululo sokugquma sinokubangela imvula, siphucule uzinzo lwesisombululo sokugquma, sandise ubomi benkonzo yesisombululo sokugquma, siphucule isantya sokufumba kwe-nickel, siphucule umgangatho womaleko wokugquma, ngokubanzi sisebenzisa i-succinin acid, i-citric acid, i-lactic acid kunye nezinye ii-organic acids kunye neetyuwa zazo.
4. Ezinye izinto: i-stabilizer inokuthintela ukubola kwesisombululo se-plating, kodwa kuba iya kuchaphazela ukwenzeka kwe-chemical plating reaction, kufuneka isetyenziswe ngokulinganisela; i-buffer inokuvelisa i-H + ngexesha le-chemical nickel plating reaction ukuqinisekisa uzinzo oluqhubekayo lwe-pH; i-surfactant inokunciphisa i-coating porosity.
02 Inkqubo yokwenza i-nickel-plating yeekhemikhali
Ukufakwa kweekhemikhali kwinkqubo ye-sodium hypophosphate kufuna ukuba i-matrix ibe nomsebenzi othile wokutsala, kwaye umphezulu wedayimani ngokwawo awunayo indawo yokusebenza yokutsala, ngoko ke kufuneka ilungiswe kwangaphambili ngaphambi kokufakwa kweekhemikhali zomgubo wedayimani. Indlela yendabuko yokutsala iikhemikhali kukususa ioyile, ukurhabaxa, ukuziva ukhululekile kunye nokusebenza.
(1) Ukususwa kweoyile, ukurhabaxa: Ukususwa kweoyile ikakhulu kukususa ioyile, amabala kunye nezinye izinto ezingcolisayo eziphilayo kumphezulu womgubo wedayimani, ukuqinisekisa ukulingana okusondeleyo kunye nokusebenza kakuhle kokwambatha okulandelayo. Ukurhabaxa kunokwenza imingxunya emincinci kunye nemingxunya kumphezulu wedayimani, kwandise uburhabaxa bomphezulu wedayimani, okungapheleli nje ekufakweni kwee-ion zesinyithi kule ndawo, kuququzelele ukurhabaxa kweekhemikhali okulandelayo kunye nokurhabaxa, kodwa kukwadala amanyathelo kumphezulu wedayimani, okubonelela ngeemeko ezilungileyo zokukhula kokurhabaxa kweekhemikhali okanye ukurhabaxa kwesinyithi okurhabaxa.
Ngokwesiqhelo, inyathelo lokususa ioyile lidla ngokuthatha i-NaOH kunye nesinye isisombululo se-alkaline njengesisombululo sokususa ioyile, kwaye kwinyathelo lokudibanisa, i-nitric acid kunye nesinye isisombululo se-asidi sisetyenziswa njengesisombululo sekhemikhali esikrwada ukukrola umphezulu wedayimani. Ukongeza, ezi khonkco zimbini kufuneka zisetyenziswe nomatshini wokucoca nge-ultrasonic, onceda ekuphuculeni ukusebenza kakuhle kokususa ioyile yomgubo wedayimani kunye nokudibanisa, konge ixesha kwinkqubo yokususa ioyile kunye nokudibanisa, kwaye kuqinisekiswe isiphumo sokususa ioyile kunye nokuthetha okrwada,
(2) Ukuqonda kunye nokusebenza: inkqubo yokuqonda kunye nokusebenza yeyona nyathelo libalulekileyo kuyo yonke inkqubo yokuchonga iikhemikhali, enxulumene ngokuthe ngqo nokuba ukuchonga iikhemikhali kungenziwa na. Ukuqonda kukufunxa izinto ezifakwe i-oxidized lula kumphezulu wedayimani powder engenawo amandla okuzenzela. Ukuqonda kukufunxa i-oxidation ye-hypophosphoric acid kunye nee-ion zesinyithi ezisebenzayo (ezifana ne-metal palladium) ekunciphiseni amasuntswana e-nickel, ukuze kukhawuleziswe izinga lokufakwa kwe-coating kumphezulu wedayimani powder.
Ngokubanzi, ixesha lonyango lokuvuselela kunye nokuvuselela lifutshane kakhulu, ukwakheka kwenqaku le-palladium yentsimbi yomphezulu wedayimani kuncinci, ukufunxwa kwengubo akwanelanga, umaleko wokugcoba kulula ukuwa okanye kunzima ukwenza ugqubuthelo olupheleleyo, kwaye ixesha lonyango lide kakhulu, kuya kubangela ukuba i-palladium point point ichithe, ngoko ke, ixesha elifanelekileyo lokuvuselela kunye nonyango lokuvuselela yi-20 ~ 30min.
(3) I-Chemical nickel plating: Inkqubo ye-chemical nickel plating ayichatshazelwa kuphela kukwakheka kwesisombululo sokugquma, kodwa ikwachatshazelwa bubushushu besisombululo sokugquma kunye nexabiso le-PH. I-Chemical nickel plating yendabuko enobushushu obuphezulu, ubushushu obuqhelekileyo buya kuba kwi-80 ~ 85℃, ngaphezulu kwe-85℃ kulula ukubangela ukubola kwesisombululo sokugquma, kwaye kubushushu obuphantsi kwe-85℃, kokukhona izinga lokuphendula likhawuleza. Kwixabiso le-PH, njengoko izinga lokufakwa kwe-pH linyuka, kodwa i-pH iya kubangela ukwakheka kwetyuwa ye-nickel kuthintela izinga lokusabela kweekhemikhali, ngoko ke kwinkqubo ye-chemical nickel plating ngokuphucula ukwakheka kwesisombululo sokugquma kweekhemikhali kunye nomlinganiselo, iimeko zenkqubo yokugquma kweekhemikhali, lawula izinga lokufakwa kwe-chemical coating, uxinano lwe-coating, ukumelana nokugqwala kwe-coating, indlela yoxinano lwe-coating, umgubo wedayimani wokugquma ukuhlangabezana neemfuno zophuhliso lwemizi-mveliso.
Ukongeza, uqweqwe olunye lusenokungafikeleli kubukhulu obufanelekileyo boqweqwe, kwaye kusenokubakho amaqamza, imingxunya yepinki kunye nezinye iziphene, ngoko ke uqweqwe oluninzi lunokusetyenziswa ukuphucula umgangatho woqweqwe kwaye kwandiswe ukusasazeka komgubo wedayimani ogqunyiweyo.
2. i-electro nickelling
Ngenxa yokubakho kwe-phosphorus kumaleko wokugquma emva kokufakelwa kwe-nickel yekhemikhali yedayimani, oku kukhokelela ekuqhutyeni kombane okungalunganga, okuchaphazela inkqubo yokulayisha isanti yesixhobo sedayimani (inkqubo yokulungisa amasuntswana edayimani kumphezulu we-matrix), ngoko ke umaleko wokugquma ongena-phosphorus ungasetyenziswa ngendlela yokugquma kwe-nickel. Umsebenzi othile kukufaka umgubo wedayimani kwisisombululo sokugquma esinee-ion ze-nickel, amasuntswana edayimani adibana ne-electrode ene-power negative kwi-cathode, ibhloko yesinyithi ye-nickel entywilisiweyo kwisisombululo sokugquma kwaye idityaniswe ne-electrode ene-power positive ukuze ibe yi-anode, ngesenzo se-electrolytic, ii-ion ze-nickel zasimahla kwisisombululo sokugquma ziyancitshiswa zibe zii-athomu kumphezulu wedayimani, kwaye ii-athomu zikhula zibe yi-coating.
01 Ukwakheka kwesisombululo sokugquma
Njengesisombululo se-chemical plating, isisombululo se-electroplating sibonelela kakhulu ngee-ion zesinyithi ezifunekayo kwinkqubo ye-electroplating, kwaye silawula inkqubo ye-nickel deposition ukuze kufunyanwe i-metal coating efunekayo. Izinto eziphambili zaso ziquka ityuwa ephambili, i-anode active agent, i-buffer agent, izongezo njalo njalo.
(1) Ityuwa ephambili: kusetyenziswa ikakhulu i-nickel sulfate, i-nickel amino sulfonate, njl. Ngokubanzi, okukhona uxinzelelo lwetyuwa oluphambili luphezulu, kokukhona ukusasazwa ngokukhawuleza kwisisombululo sokugquma, kokukhona ukusebenza kakuhle kwangoku kuphezulu, izinga lokufakwa kwesinyithi liphezulu, kodwa iinkozo zokugquma ziya kuba zirhabaxa, kwaye ukwehla koxinzelelo lwetyuwa oluphambili, ukuhanjiswa koxinzelelo kube kubi kakhulu, kwaye kunzima ukulawula.
(2) I-Anode active agent: kuba i-anode kulula ukuyidlulisa, kulula ukuya ekuqhubeni kakuhle, ichaphazela ukufana kokusasazwa kwangoku, ngoko ke kuyimfuneko ukongeza i-nickel chloride, i-sodium chloride kunye nezinye ii-agents njenge-anodic activator ukukhuthaza ukusebenza kwe-anode, ukuphucula uxinano lwangoku lwe-anode passivation.
(3) I-arhente ye-buffer: njengesisombululo se-chemical plating, i-arhente ye-buffer inokugcina uzinzo oluhambelanayo lwesisombululo se-plating kunye ne-cathode pH, ukuze ikwazi ukutshintsha-tshintsha ngaphakathi koluhlu oluvumelekileyo lwenkqubo ye-electroplating. I-arhente ye-buffer eqhelekileyo ine-boric acid, i-acetic acid, i-sodium bicarbonate njalo njalo.
(4) Ezinye izongezo: ngokweemfuno zokwambathisa, yongeza ubungakanani obufanelekileyo be-agent ekhanyayo, i-agent yokulinganisa, i-agent yokumanzisa kunye ne-arhente eyahlukeneyo kunye nezinye izongezo ukuphucula umgangatho we-coating.
02 I-Diamond electroplated nickel flow
1. Unyango lwangaphambi kokufakelwa: idayimani ayihlali ihambisa umbane, kwaye kufuneka ifakwe umaleko wesinyithi ngezinye iinkqubo zokugquma. Indlela yokugquma iikhemikhali idla ngokusetyenziswa ukugquma umaleko wesinyithi kunye nokuqina, ngoko ke umgangatho wokugquma iikhemikhali uya kuchaphazela umgangatho womaleko wokugquma ukuya kwinqanaba elithile. Ngokubanzi, umxholo we-phosphorus kwi-coating emva kokugquma iikhemikhali unempembelelo enkulu kumgangatho wokugquma, kwaye i-phosphorus ephezulu yokugquma inokumelana nokugqwala okungcono kwindawo ene-asidi, umphezulu wokugquma une-tumor bulge engaphezulu, uburhabaxa obukhulu bomphezulu kwaye awunayo ipropathi yemagnethi; i-phosphorus ephakathi yokugquma inokumelana nokugqwala kunye nokuguguleka; i-phosphorus ephantsi yokugquma inokuqhuba okungcono.
Ukongeza, okukhona ubukhulu besuntswana lomgubo wedayimani buncinci, kokukhona indawo ethile yomphezulu inkulu, xa kugqunywa, kulula ukudada kwisisombululo sokugqunywa, kuya kuvelisa ukuvuza, ukugqunywa, ukugqunywa kwento ekhululekileyo yomaleko, ngaphambi kokugqunywa, kufuneka kulawulwe umxholo we-P kunye nomgangatho wokugqunywa, ukulawula ukuhanjiswa kunye noxinano lomgubo wedayimani ukuphucula umgubo olula ukudada.
2, i-nickel plating: okwangoku, i-diamond powder plating idla ngokusebenzisa indlela yokugquma, oko kukuthi, isixa esifanelekileyo sesisombululo se-electroplating songezwa kwibhotile, isixa esithile se-artificial diamond powder kwisisombululo se-electroplating, ngokujikeleza kwebhotile, siqhube i-diamond powder kwibhotile ukuze iqengqeleke. Kwangaxeshanye, i-positive electrode iqhagamshelwe kwi-nickel block, kwaye i-negative electrode iqhagamshelwe kwi-artificial diamond powder. Phantsi kwesenzo sentsimi yombane, ii-nickel ion ezikhululekileyo kwisisombululo se-plating zenza i-metal nickel kumphezulu we-artificial diamond powder. Nangona kunjalo, le ndlela ineengxaki zokusebenza okuphantsi kwe-coating kunye ne-engalinganiyo coating, ngoko ke indlela ye-rotary electrode yavela.
Indlela ye-electrode ejikelezayo kukujikeleza i-cathode kwi-diamond powder plating. Ngale ndlela inokunyusa indawo yoqhagamshelwano phakathi kwe-electrode kunye namasuntswana edayimani, yonyuse ukuhanjiswa okufanayo phakathi kwamasuntswana, iphucule ukungalingani kokugquma, kwaye iphucule ukusebenza kakuhle kwemveliso ye-diamond nickel plating.
isishwankathelo esifutshane
Njengezinto eziphambili ezisetyenziswa kwizixhobo zedayimani, ukuguqulwa komphezulu wedayimani micropowder yindlela ebalulekileyo yokuphucula amandla olawulo lwe-matrix kunye nokuphucula ubomi benkonzo yezixhobo. Ukuze kuphuculwe izinga lokulayisha isanti kwizixhobo zedayimani, umaleko we-nickel kunye ne-phosphorus unokugqunywa kumphezulu wedayimani micropowder ukuze ube nombane othile, uze emva koko ujiye umaleko weplating nge-nickel plating, kwaye uphucule umbane. Nangona kunjalo, kufuneka kuqatshelwe ukuba umphezulu wedayimani ngokwawo awunayo indawo esebenzayo yokulungisa, ngoko ke kufuneka ulungiswe kwangaphambili ngaphambi kokuba kugqitywe ngekhemikhali.
amaxwebhu esalathiso:
ULiu Han. Uphononongo malunga netekhnoloji yokugquma umphezulu kunye nomgangatho wepowder yedayimani yokwenziwa [D]. I-Zhongyuan Institute of Technology.
UYang Biao, uYang Jun, kunye noYuan Guangsheng. Uphononongo ngenkqubo yonyango lwangaphambi kokugquma umphezulu wedayimani [J]. Ukulungiswa kwesithuba sendawo.
ULi Jinghua. Uphando malunga nokuguqulwa komphezulu kunye nokusetyenziswa komgubo wedayimani encinci yokwenziwa osetyenziselwa isarha yentambo [D]. I-Zhongyuan Institute of Technology.
UFang Lili, uZheng Lian, uWu Yanfei, nabanye. Inkqubo yokugquma i-nickel yekhemikhali kumphezulu wedayimani yokwenziwa [J]. Ijenali ye-IOL.
Eli nqaku liphinde lashicilelwa kwinethiwekhi yezinto ezilukhuni kakhulu
Ixesha leposi: Matshi-13-2025
