Njengemveliso ukuya kwinguqu ephezulu, uphuhliso olukhawulezayo kwintsimi yamandla acocekileyo kunye ne-semiconductor kunye nophuhliso loshishino lwe-photovoltaic, ngokusebenza okuphezulu kunye nobuchule obuphezulu bokuchaneka kwezixhobo zedayimani ezikhulayo, kodwa umgubo wedayimane owenziweyo njengeyona nto ibalulekileyo ekrwada, i-diamond County kunye ne-matrix yokubamba amandla ayinamandla lula ubomi besixhobo se-carbide abukho ixesha elide. Ukuze kusonjululwe ezi ngxaki, ishishini ngokubanzi lamkela i-diamond powder surface coating kunye nezixhobo zetsimbi, ukuphucula iimpawu zayo zomphezulu, ukwandisa ukuqina, ukuze kuphuculwe umgangatho wesixhobo.
Indlela yokwaleka umphezulu wedayimani yomgubo wedayimani ungaphezulu, kubandakanywa ukufakwa kweekhemikhali, i-electroplating, i-magnetron sputtering plating, i-vacuum evaporation plating, ukusabela okutshisayo, njl.
1. ukufakwa kweekhemikhali
Idayimani yomgubo wekhemikhali yokwaleka kukubeka umgubo wedayimani onyangweyo kwisisombululo sokugquma imichiza, kwaye ufake iiyoni zetsimbi kwisisombululo sokwaleka ngesenzo searhente yokunciphisa kwisisombululo sekhemikhali sokutyabeka, senza intsimbi eshinyeneyo yokwaleka. Okwangoku, eyona isetyenziswa kakhulu i-diamond chemical plating yikhemikhali yenickel plating-phosphorus (Ni-P) i-binary alloy idla ngokubizwa ngokuba yikhemikhali nickel plating.
01 Ukuqulunqwa kwesisombululo se-nickel se-chemical plating
Ukubunjwa kwesisombululo se-chemical plating kunempembelelo eqinisekileyo kwinkqubela phambili egudileyo, ukuzinza kunye nomgangatho wokugquma we-chemical reaction yayo. Ngokuqhelekileyo iqulethe ityuwa ephambili, i-agent yokunciphisa, i-complexer, i-buffer, i-stabilizer, i-accelerator, i-surfactant kunye nezinye izinto. Umlinganiselo wecandelo ngalinye kufuneka ulungelelaniswe ngokucophelela ukuze ufezekise umphumo ongcono wokugquma.
I-1, ityuwa ephambili: ngokuqhelekileyo i-nickel sulfate, i-nickel chloride, i-nickel amino sulfonic acid, i-nickel carbonate, njl., indima yayo ephambili kukubonelela ngomthombo we-nickel.
2. I-arhente yokunciphisa: ibonelela ikakhulu i-athom hydrogen, inciphisa i-Ni2 + kwisisombululo se-plating ibe yi-Ni kwaye ibeke phezu kwamasuntswana edayimani, eyona nto ibalulekileyo kwisisombululo se-plating. Kwishishini, i-sodium ye-phosphate yesibini enobuchule obunamandla bokunciphisa, ixabiso eliphantsi kunye nokuzinza okuhle kwe-plating isetyenziswa kakhulu njenge-arhente yokunciphisa. Inkqubo yokunciphisa inokufikelela kwi-chemical plating kwiqondo lokushisa eliphantsi kunye nokushisa okuphezulu.
I-3, i-agent eyinkimbinkimbi: isisombululo sokugquma sinokunyusa imvula, siphucule ukuzinza kwesisombululo sokugquma, ukwandisa ubomi benkonzo yesisombululo se-plating, ukuphucula isantya sokubeka i-nickel, ukuphucula umgangatho we-coating layer, ngokuqhelekileyo zisebenzisa i-succinin acid, i-citric acid, i-lactic acid kunye nezinye i-asidi eziphilayo kunye neetyuwa zazo.
4. Amanye amacandelo: i-stabilizer inokuthintela ukubola kwesisombululo se-plating, kodwa ngenxa yokuba iya kuchaphazela ukuvela kwe-chemical plating reaction, idinga ukusetyenziswa okuphakathi; i-buffer inokuvelisa i-H + ngexesha le-chemical nickel plating reaction ukuqinisekisa ukuzinza okuqhubekayo kwe-pH; i-surfactant inokunciphisa i-porosity yokwambathisa.
02 Inkqubo yokufakwa kwemichiza yenikeli
Ukufakwa kweekhemikhali zenkqubo ye-sodium hypophosphate kufuna ukuba imatrix ibe nomsebenzi othile obangela i-catalytic, kwaye umphezulu wedayimani ngokwawo awunalo iziko le-catalytic action, ngoko ke kufuneka ilungiswe kwangaphambili phambi kokufakwa kwemichiza yomgubo wedayimani. Indlela yesintu yokwenziwa kwangaphambi kokutyalwa kweekhemikhali kukususwa kweoyile, ukurhabula, ukwazisa kunye nokwenza ukuba kusebenze.
(1) Ukususwa kwe-oyile, ukurhaxa: ukususwa kwe-oyile kukususa i-oyile, amabala kunye nezinye izinto ezingcolisa i-oyile kumphezulu wedayimani yomgubo, ukuqinisekisa ukulingana okusondeleyo kunye nokusebenza kakuhle kokutyabeka okulandelayo. I-coarsening inokwenza imingxunya emincinci kunye neentanda kumphezulu wedayimani, yandise uburhabaxa bomphezulu wedayimani, engenzi nje ukubhengeza i-ion zetsimbi kule ndawo, iququzelele i-chemical plating elandelayo kunye ne-electroplating, kodwa yenza amanyathelo kumphezulu wedayimani, ibonelela ngeemeko ezifanelekileyo zokukhula kwe-chemical plating okanye i-electroplating metal deposition.
Ngokuqhelekileyo, inyathelo lokususa i-oyile lidla ngokuthatha i-NaOH kunye nesinye isisombululo se-alkaline njengesisombululo sokususa ioli, kunye nesinyathelo esinqabileyo, i-nitric acid kunye nesinye isisombululo se-asidi sisetyenziswa njengesisombululo seekhemikhali ezikrwada zokubeka umphezulu wedayimane. Ukongeza, ezi zikhonkco zimbini kufuneka zisetyenziswe kunye nomatshini wokucoca we-ultrasonic, onceda ekuphuculeni ukusebenza kakuhle kokususwa kweoli yedayimane yomgubo kunye ne-coarsening, gcina ixesha lokususwa kwe-oyile kunye nenkqubo yokucoca, kunye nokuqinisekisa isiphumo sokususwa kweoyile kunye nentetho erhabaxa,
(2) I-Sensitization kunye nokusebenza: inkqubo yokuvuselela kunye nokusebenza iyona nyathelo elibaluleke kakhulu kuyo yonke inkqubo yokucoca imichiza, ehambelana ngokuthe ngqo nokuba i-chemical plating ingenziwa. Uvakalelo kukuthengisa izinto ezixutywe neoksijini ngokulula kumphezulu wedayimani engumgubo ongenasakhono sokuzisebenzela. I-activation kukungenisa i-oxidation ye-hypophosphoric acid kunye ne-ion zetsimbi esebenzayo (ezifana ne-metal palladium) ekunciphiseni amasuntswana e-nickel, ukuze kukhawuleziswe izinga lokubeka i-coating kumphezulu we-diamond powder.
Ngokuqhelekileyo, ixesha lokuvuselela kunye nokuvula unyango lifutshane kakhulu, i-diamond surface metal palladium point formation incinci, i-adsorption ye-coating akwanelanga, umaleko wokugquma kulula ukuwa okanye kunzima ukwenza i-coating epheleleyo, kwaye ixesha lonyango lide kakhulu, liya kubangela inkunkuma yenqaku le-palladium, ngoko ke, elona xesha lilungileyo lokuvuselela i-20min.
(3) I-Chemical nickel plating: inkqubo ye-chemical nickel plating ayichaphazeli nje kuphela ukubunjwa kwesisombululo sokugubungela, kodwa iphinda ichaphazeleke kwiqondo lokushisa lobushushu kunye nexabiso le-PH. Traditional ubushushu eliphezulu imichiza nickel plating, ubushushu jikelele iya kuba 80 ~ 85 ℃, ngaphezulu kwe 85 ℃ lula ukubangela ukubola kwesisombululo plating, kwaye ngaphantsi kwe 85 ℃ lobushushu, ngokukhawuleza izinga reaction. Kwixabiso le-PH, njengoko i-pH inyusa izinga lokubeka ukutyabeka liya kunyuka, kodwa i-pH iya kubangela ukubunjwa kwentlenga ye-nickel yetyuwa inhibit ireyithi yokusabela kweekhemikhali, ngoko ke kwinkqubo yekhemikhali ye-nickel yokucwenga ngokulungisa ukubunjwa kwesisombululo sekhemikhali kunye nomlinganiselo, iimeko zenkqubo yokubekwa kweekhemikhali, ukulawula izinga lokubekwa kweekhemikhali, ukuxinana kokutyabeka, ukuchasa ukuxinana komgubo wedayimani, ukuhlangabezana nophuhliso lwedayimani yophuhliso lwedayimani.
Ukongeza, i-coating enye ayinakufezekisa ubungakanani obufanelekileyo bokugquma, kwaye kunokubakho amaqamza, imingxunya kunye nezinye iziphene, ngoko ke ukugquma okuninzi kunokuthathwa ukuphucula umgangatho wokwaleka kunye nokwandisa ukusasazwa komgubo wedayimane ogqunyiweyo.
2. i-electro nickling
Ngenxa yobukho phosphorus umaleko ukutyabeka emva diamond imichiza nickel plating, oko kukhokelela conductivity kakubi zombane, nto leyo echaphazela inkqubo isanti kulayishwa isixhobo diamond (inkqubo yokulungisa amasuntswana diamond kumphezulu matrix), ngoko umaleko Plating ngaphandle phosphorus ingasetyenziswa ngendlela nickel plating. Umsebenzi othile kukubeka umgubo wedayimane kwisisombululo sokugquma esine-nickel ion, amasuntswana edayimane adityaniswe ne-electrode engalunganga yamandla kwi-cathode, ibhloko yensimbi yenickel entywiliselwe kwisisombululo sokucwenga kwaye idityaniswe ne-electrode enamandla ukuze ibe yi-anode, ngesenzo se-electrolytic, iiyoni zenickel zasimahla kwisisombululo sokugquma ziyancitshiswa zibe zii-athomu kumphezulu wedayimane, kwaye zikhule zibe yi-coating yedayimane.
01 Ukuqulunqwa kwesisombululo seplating
Njengesisombululo se-chemical plating, isisombululo se-electroplating sibonelela kakhulu ngee-ion zetsimbi eziyimfuneko kwinkqubo ye-electroplating, kwaye ilawula inkqubo yokubeka i-nickel ukufumana i-coating yensimbi efunekayo. Amacandelo ayo aphambili abandakanya ityuwa ephambili, i-anode esebenzayo, i-buffer agent, izongezo kunye nokunye.
(1) Ityuwa engundoqo: ubukhulu becala kusetyenziswa i-nickel sulfate, i-nickel amino sulfonate, njl. Ngokuqhelekileyo, ukuphakama kwetyuwa engundoqo, ngokukhawuleza ukusasazwa kwisisombululo se-plating, ukuphakama okuphezulu kwangoku, isantya sokubekwa kwesinyithi, kodwa iinkozo zokugquma ziya kuba rhabaxa, kunye nokuncipha koxinzelelo lwetyuwa oluphambili, ukonakala kwe-conductivity embi kakhulu, kwaye kunzima ukulawula.
(2) I-anode ye-agent esebenzayo: ngenxa yokuba i-anode ilula ukugqithiswa, kulula ukungahambi kakuhle, echaphazela ukufana kokusasazwa kwangoku, ngoko ke kuyimfuneko yokongeza i-nickel chloride, i-sodium chloride kunye nezinye i-agent njenge-activator ye-anodic ukukhuthaza ukusebenza kwe-anode, ukuphucula ukuxinwa kwangoku kwe-anode passivation.
(3) I-agent ye-buffer: njengesisombululo se-chemical plating, i-agent ye-buffer inokugcina uzinzo oluhambelana nesisombululo se-plating kunye ne-cathode pH, ukwenzela ukuba ikwazi ukuguquguquka ngaphakathi koluhlu oluvumelekileyo lwenkqubo ye-electroplating. I-arhente ye-buffer eqhelekileyo ine-boric acid, i-acetic acid, i-sodium bicarbonate njalo njalo.
(4) Ezinye izongezo: ngokweemfuno zokugquma, yongeza inani elifanelekileyo le-ejenti eqaqambileyo, i-agent yokulinganisa, i-agent yokumanzisa kunye ne-agent exutywe kunye nezinye izongezo zokuphucula umgangatho wokugquma.
02 Ukuqukuqela kwe-nickel yeDayimani efakwe kwi-electroplated
1. Ukulungiswa kwangaphambili ngaphambi kokutyalwa: idayimani kaninzi ayiqhubeki, kwaye idinga ukugqithwa ngomqolo wesinyithi ngokusebenzisa ezinye iinkqubo zokugquma. Indlela yokufakwa kweekhemikhali isoloko isetyenziselwa ukubeka ngaphambili umaleko wesinyithi kwaye ujiye, ngoko ke umgangatho wokwalekwa kweekhemikhali uya kuchaphazela umgangatho womaleko wokucwenga ukuya kumlinganiselo othile. Ukuthetha ngokubanzi, umxholo we-phosphorus kwi-coating emva kokutyalwa kweekhemikhali kunempembelelo enkulu kumgangatho wokwaleka, kwaye i-phosphorus ephezulu yokwaleka inokumelana ne-corrosion engcono kwindawo ene-acidic, indawo yokwaleka ine-tumor engaphezulu, uburhabaxa obukhulu kwaye akukho propati yemagnethi; i-coating ye-phosphorus ephakathi inokuxhathisa ukubola kunye nokumelana nokunxiba; i-phosphorus ephantsi yokwaleka ine-conductivity engcono kakhulu.
Ukongeza, ubungakanani bamasuntswana omgubo wedayimani buncinci, ubukhulu bendawo ethile, xa kugqunywa, kulula ukudada kwisisombululo se-plating, kuya kuvelisa ukuvuza, ukugquma, ukugquma isenzeko somaleko, ngaphambi kokubekwa, kufuneka kulawule umxholo weP kunye nomgangatho wokugquma, ukulawula ukuqhutywa kunye noxinzelelo lwedayimani yomgubo ukuphucula umgubo ukudada lula.
I-2, i-nickel plating: okwangoku, i-diamond powder plating ihlala ithatha indlela yokugubungela, oko kukuthi, ubungakanani obufanelekileyo besisombululo se-electroplating songezwa ebhotileni, umlinganiselo othile womgubo wedayimane owenziweyo kwisisombululo se-electroplating, ngokujikeleza kwebhotile, uqhube umgubo wedayimane kwibhotile ukuze uqengqe. Ngelo xesha, i-electrode efanelekileyo idibaniswe ne-nickel block, kwaye i-electrode engafanelekanga idibaniswa ne-powder diamond eyenziwe. Ngaphantsi kwesenzo sommandla wombane, i-nickel ions ikhululekile kwisisombululo se-plating senza i-nickel yensimbi ebusweni bepowder yedayimane eyenziweyo. Nangona kunjalo, le ndlela ineengxaki zokungaphumeleli kokutyabeka okuphantsi kunye nokulinganisa okungalinganiyo, ngoko ke indlela ye-electrode ejikelezayo yaba khona.
Indlela ye-electrode ejikelezayo kukujikeleza i-cathode kwi-diamond powder plating. Le ndlela inokunyusa indawo yoqhagamshelwano phakathi kwe-electrode kunye ne-diamond particles, yandise i-conductivity efanayo phakathi kweengqungquthela, iphucule into engalinganiyo yokugqoka, kunye nokuphucula ukuveliswa kwemveliso ye-diamond nickel plating.
isishwankathelo esifutshane
Njengeyona nto iphambili yezixhobo zedayimani, ukuguqulwa komphezulu wedayimane micropowder yindlela ebalulekileyo yokuphucula amandla okulawula i-matrix kunye nokuphucula ubomi benkonzo yezixhobo. Ukuze kuphuculwe izinga lokulayishwa kwesanti yezixhobo zedayimani, umaleko wenickel kunye nephosphorus idla ngokugatywa kumphezulu wedayimani micropowder ukuze ube neconductivity ethile, uze ujiye umaleko wokutyabeka nge-nickel plating, kwaye uphucule ukuhanjiswa. Nangona kunjalo, kufuneka kuqatshelwe ukuba umphezulu wedayimani ngokwawo awunalo iziko elisebenzayo elisebenzayo, ngoko ke kufuneka licocwe phambi kokufakwa kwemichiza.
uxwebhu lwereferensi:
Liu Han. Uphononongo kwitekhnoloji yokwaleka komphezulu kunye nomgangatho wedayimani eyenziwe ngumgubo omncinci [D]. Zhongyuan Institute of Technology.
Yang Biao, Yang Jun, kunye Yuan Guangsheng. Uphononongo kwinkqubo yonyango lwangaphambili lwedayimani yokwaleka komphezulu [J]. Umgangatho wesithuba sendawo.
Li Jinghua. Uphando malunga nokuguqulwa komphezulu kunye nokusetyenziswa kwedayimane yokwenziwa ngumgubo omncinci osetyenziselwa isarha yocingo [D]. Zhongyuan Institute of Technology.
UFang Lili, uZheng Lian, uWu Yanfei, et al. Inkqubo yokufakwa kwemichiza yenikeli yomphezulu wedayimani eyenziweyo [J]. Ijenali ye-IOL.
Eli nqaku liprintwe kwakhona kuthungelwano lwezinto eziphathekayo
Ixesha lokuposa: Mar-13-2025
